• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    The present invention discloses a temperature measuring apparatus 102, an electrical assembly 103, and a battery pack. The temperature measuring apparatus 102 comprises a heat transfer element 10, a temperature measuring device 20, and a wiring board 40. The heat transfer element 10 is arranged to be in thermally conductive contact with a heat transfer element 10. object 50 to measure. The temperature measuring device 20 is provided in contact with the heat transfer element 10 and arranged to be spaced from the object 50 to be measured. The temperature measuring device 20 is arranged to detect a temperature of the object 50 to be measured and can output a temperature signal. The wiring board 40 is electrically connected to the temperature measuring device 20 for receiving and transmitting the temperature signal output from the temperature measuring device 20. The present invention requires only a thermally conductive contact between the heat transfer 10 and the temperature measuring device 20 of the temperature measuring apparatus 102, thereby facilitating assembly. Compared with the insulation with the measuring object 50 made by glue filling after connection of the single-core wire to the temperature measuring device 20, the temperature measuring apparatus 102 of the present invention substantially reduces the procedures of the invention. 'assembly.
    公开号:FR3057952A3
    申请号:FR1757463
    申请日:2017-08-03
    公开日:2018-04-27
    发明作者:Jifa Wang；Xiao Zhou
    申请人:Tyco Electronics Shanghai Co Ltd；Tyco Electronics Technology SIP Ltd；
    IPC主号:
    专利说明:

    TEMPERATURE MEASURING APPARATUS, ELECTRICAL ASSEMBLY AND
    BATTERY PACK
    The present invention generally relates to a structure for temperature measurement, and in particular to a temperature measuring apparatus, an electrical assembly and a battery pack, which can be implemented in an electric vehicle.
    With the growing application of new energy sources, electric vehicles are becoming more and more popular with consumers. A battery pack is a power source for an electric vehicle, the stable operation of the battery pack is essential to the safety performance of the vehicle. The vehicle battery pack produces a relatively large current during operation, which easily causes a rise in temperature. Usually, it is necessary to monitor the operating parameters of the battery pack to ensure safe driving of a vehicle. The current emitted by the battery pack and its temperature are parameters that must be particularly monitored. In the prior art, current and temperature signals of the vehicle battery pack are generally transmitted in a projection line mode (e.g., a single core wired connection). When it is necessary to simultaneously detect a plurality of battery cells in the vehicle battery pack, such single-core wired connection very quickly results in poor wiring, occupying the narrow mounting space in the battery pack of the battery pack. vehicle. In addition, such a single-core wired connection is easily used, which causes short-circuit problems. In addition, the means for a stable connection of the single-core wired connection with a temperature measuring device for measuring temperature are rather complex, with a higher manufacturing cost.
    To overcome the shortcomings of the prior art, one of the objectives of the present invention is to provide a temperature measuring apparatus, an electrical assembly and a battery pack, which are convenient to assemble, with stable and stable performance. .
    To achieve the above objectives, this utility model is implemented through the following technical solutions:
    The present invention relates to a temperature measuring apparatus. The temperature measuring apparatus comprises a heat transfer element, a temperature measuring device, and a wiring board. The heat transfer element is arranged to provide thermally conductive contact with an object to be measured. The temperature measuring device is provided in contact with the heat transfer element and at a distance from the object to be measured. The temperature measuring device is arranged to detect the temperature of the object to be measured and can deliver a temperature signal. The wiring board is electrically connected to the temperature measuring device for receiving and transmitting the temperature signal outputted by the temperature measuring device.
    Preferably, the wiring board has a connection portion protruding in the width direction; the heat transfer element and the temperature measuring device are arranged on the connection part.
    Preferably, an observation hole extends through the connecting portion in the direction of the thickness; and the observation hole and the heat transfer element are arranged to face each other directly.
    Preferably, the observation hole comprises at least two observation holes, said at least two observation holes being arranged sequentially along a protrusion direction of the connection portion; and all the observation holes are arranged to directly face the heat transfer element.
    Preferably, the wiring board is a rigid printed circuit board or a flexible printed circuit board.
    Preferably, the temperature measuring device and the wiring board are connected by SMT soldering (surface mount technology).
    Preferably, the heat transfer element is a thermally conductive silicone gel pad.
    Preferably, the heat transfer element is an integral element made of a self-adhesive silicone gel material.
    Preferably, the heat transfer element is arranged to deform when compressed by the temperature measuring device to thereby form a recess housing the temperature measuring device.
    Preferably, the temperature measuring device is provided in contact with a bottom wall and a side wall of the recess.
    Preferably, an upper surface of the heat transfer member and an upper surface of the temperature measuring device are provided coplanarly.
    Preferably, the temperature measuring device is a heat-sensitive resistor.
    Preferably, the temperature measuring device is a surface mounted device (SMD) resistor and connected to the solder wiring board.
    Preferably, the temperature measuring device is a thermosensitive resistor with a negative temperature coefficient.
    The present disclosure further relates to an electrical assembly. The electrical assembly comprises an object to be measured and a temperature measuring apparatus according to any of the aforementioned elements. The heat transfer element and the object to be measured are provided in thermally conductive contact.
    Preferably, the temperature measuring device and the object to be measured are isolated.
    Preferably, the temperature measuring device and the object to be measured are provided isolated by the heat transfer element.
    Preferably, a lower surface of the heat transfer element and an upper surface of the object to be measured are provided in contact.
    Preferably, an upper surface of the heat transfer member and a lower surface of the wiring board are provided in contact.
    Preferably, the heat transfer element is provided to deform under pressure between the wiring board and the object to be measured.
    Preferably, the electrical assembly further comprises a connection grid; and the wiring board and the object to be measured are respectively provided on the lead frame.
    Preferably, the object to be measured is a bus bar to be connected to the battery cells. Preferably, the busbar is electrically connected to the wiring board.
    The present invention further relates to a battery pack, comprising a plurality of battery cells and an electrical assembly according to any one of the above-mentioned elements, the battery cells being electrically connected to the object to be measured.
    Compared to the prior art, the present invention requires only thermally conductive contact between the thermal element and the temperature measuring device of the temperature measuring apparatus, which facilitates assembly. Compared to the insulation with the object to be measured by glue-filling after connecting the single core wire to the temperature measuring device, the temperature measuring apparatus of the present invention greatly reduces the assembly procedures.
    Preferably, the heat transfer element uses a thermally conductive silicone gel pad, which not only provides excellent heat conducting performance, but also in terms of insulation. In addition, the heat transfer element consists of a self-adhesive silicone gel, which can facilitate assembly, assembly or contact with other components. The temperature meter uses a wiring board, instead of the projection line connection approach, to transmit current and temperature signals, thereby improving transmission performance and making the configuration reasonable and orderly.
    Fig. 1 is a structural diagram of a temperature measuring apparatus provided on an upper surface of a wiring board according to the present invention.
    Fig. 2 is a structural diagram of the temperature measuring apparatus of Fig. 1 showing a bottom surface of the wiring board.
    Figure 3 is a structural diagram of the temperature measuring assembly of Figure 1.
    FIG. 4 is an exploded perspective diagram of the temperature measurement assembly of FIG. 3.
    Fig. 5 is a structural diagram as shown in Fig. 3 when the heat transfer element is not deformed.
    Figure 6 is a front view of the temperature measuring apparatus of Figure 1.
    Fig. 7 is a sectional view of the temperature measuring apparatus of Fig. 6 along the line A-A.
    Fig. 8 is a structural diagram of an embodiment of an electrical assembly of the present invention.
    Figure 9 is an exploded perspective diagram of the electrical assembly of Figure 8.
    FIG. 10 is a front view of the electrical assembly of FIG. 8.
    Fig. 11 is a sectional view of the electrical assembly of Fig. 10 along the line B-B.
    Fig. 12 is a structural diagram of another embodiment of an electrical assembly of the present invention.
    Embodiments of the present invention by way of example will be described in detail below with reference to the accompanying drawings:
    Embodiment 1:
    Figure 1 and Figure 2 show a temperature measuring apparatus 102 according to the present invention. The temperature measuring apparatus 102 includes a wiring board 40 and a temperature measuring assembly 101. The wiring board 40 and the temperature measuring assembly 101 are electrically connected.
    FIG. 3 and FIG. 4 show the temperature measuring assembly 101 comprising a heat transfer element 10 and a temperature measuring device 20. The heat transfer element 10 is in thermally conductive contact with an object 50 to measure that will be described later. The temperature measuring device 20 is in contact with the heat transfer element 10 and arranged to be spaced from the object 50 to be measured.
    Figure 5, in combination, shows the heat transfer element 10 arranged to provide a heat conducting contact with the object 50 to be measured. It can be envisaged that by reaching a thermal balance the heat transfer element 10 will have the same temperature as the object 50 to be measured, thereby facilitating the temperature measuring device 20 to indirectly measure the temperature of the heat. 50 to be measured, directly measuring the temperature of the heat transfer 10. It is sufficient that the shape and structure of the heat transfer element 10 can conduct heat and that the temperature measuring device 20 is spaced apart. of the object 50 to be measured. In order to improve the measurement accuracy, the heat transfer element 10 is made of an insulating material. In the present embodiment, in order to obtain good heat conduction, insulation and space saving, the heat transfer element is a thermally conductive silicone gel pad. It may be contemplated to designate the thermally conductive silicone gel pad as a thermally conductive silicone gel sheet, a thermally conductive silica gel pad or a flexible heat sink pad, etc. To implement a convenient and secure assembly and mounting, the heat transfer member 10 is made of a self-adhesive silicone gel material. To facilitate space saving and to form a stable contact, the heat transfer element 10 is provided to deform when compressed by the temperature measuring device 20 to thereby form a recess 11 for receiving the device. In the present embodiment, the recess 11 is formed on an upper surface of the heat transfer element 10. To further reduce the thermal resistance and thereby improve the thermal performance, the recess 11 of the heat transfer element 10 is arranged such that the temperature measuring device 20 is in contact with a bottom wall and a side wall of the recess 11. To make sufficient use of the mounting space, when the temperature measuring device 20 is housed in the recess 11, an upper surface of the heat transfer element 10 and an upper surface of the measuring device temperature 20 are arranged coplanarly. In the present embodiment, the heat transfer element 10 is substantially oblong plate-shaped, when not deformed. If necessary, the heat transfer element 10 may have plastic deformation or elastic deformation.
    Still with reference to FIG. 3 and FIG. 4, the temperature measuring device 20 is intended to directly measure the temperature of the heat transfer element 10, thereby indirectly obtaining a temperature of the object 50 to be measured. . The temperature measuring device 20 may be a thermally sensitive element, which can convert the measured temperature into a corresponding temperature signal to output. In the present embodiment, to facilitate the transfer of the temperature signal, the temperature measuring device 20 is a thermally sensitive resistor for converting the measured temperature into an electrical signal. To effectively provide a secure connection between the temperature measuring device 20 and a circuit board 40 which will be described later, the temperature measuring device 20 is a surface mount device (SMD) thermosensitive resistor. The temperature measuring device 20 and the wiring board 40 are electrically connected by wave soldering. To improve the accuracy of the measurement, the temperature measuring device 20 is a thermosensitive resistor to the negative temperature coefficient (NTC). The specific parameters and specifications of the temperature measuring device 20 are selected as required. In the present embodiment, the temperature measuring device 20 is compressed by the wiring board 40, with the result that the heat transfer element 10 forms a recess 11. The temperature measuring device 20 is in contact with the bottom wall and the side wall of the recess 11. The temperature measuring device 20, when compressed, moves to a position such that the upper surface of the temperature measuring device 20 is coplanar with the upper surface of the heat transfer element 10.
    Figure 6 and Figure 7 in combination show the wiring board 40, also called a circuit board or printed circuit board (PCB). In addition, to improve the transport performance of the wiring board 40, the wiring board 40 is a rigid printed circuit board. It goes without saying that the rigid printed circuit board is an alternative concept to the flexible printed circuit board. The wiring board 40 is for transmitting a temperature signal and other forms of electric signal or electric current. The shapes and specifications of the wiring board 40 are selected according to the connection requirements. In the present embodiment, the wiring board 40 is substantially elongated plate-shaped. If necessary, the wiring board 40 may be a flexible printed circuit board (FPCB). In the present embodiment, the circuit board 40 may also be electrically connected to an object 50 to be measured which will be described later, so as to transmit other forms of electrical signal or electric current.
    To facilitate the formation of a stable connection with the temperature measuring device 20, the wiring board 40 has a connection portion 41 protruding in the width direction. The connection portion 41 is connected to the temperature measuring device 20. The connection portion 41 may be of various configurations provided that it facilitates connection with the temperature measuring device 20. In the present embodiment, the portion of connection 41 is substantially a rectangular plate form with net. The number of connection parts and their specific positions are chosen according to the corresponding temperature measuring device. In the present embodiment, three connection portions 41 are provided. The three connecting portions 41 are substantially located at the vertices of an acute triangle.
    To facilitate conformity of the accuracy of the mounting positions of the heat transfer element 10, an observation hole 43 is extended through the connection portion 41 in the thickness direction. The observation hole 43 is arranged to directly face the heat transfer element 10. In other words, it is only necessary to observe the heat transfer element 10 through the observation hole 43. In order to improve the mounting accuracy, at least two observation holes 43 are provided. Said at least two observation holes 43 are arranged sequentially along a projecting direction of the connection portion 41. All the observation holes 43 are arranged to directly face the heat transfer element. . In the present embodiment, two observation holes 43 are provided on each of the connection portions 41.
    To facilitate the transport of the assembly and improve safety, the wiring board 40 is provided on a lead frame 60 which will be described later.
    Embodiment II:
    Figures 8 to 11 show an electrical assembly 103 according to the present invention. The electrical assembly 103 comprises an object 50 to be measured and the temperature measuring apparatus 102 as described in embodiment 2. The heat transfer element 10 provides a heat conducting contact with an object 50 to be measured . The object 50 to be measured is selected according to the needs of the application. The object 50 to be measured may be an electronic product. In the present embodiment, the object 50 to be measured is a bus bar. The busbar can transmit a relatively large current and therefore has a relatively large heat capacity. In the present embodiment, the bus bar is arranged to connect batteries in the battery pack in a vehicle. The specifications and specific busbar settings are selected based on the needs of the application. To save sufficient mounting space and reduce the thermal resistance to improve measurement accuracy and speed, an upper surface of the object 50 to be measured is provided in contact with a lower surface of the heat transfer member 10 .
    To facilitate transportation and improve security, in the present embodiment, the object 50 to be measured is provided on a lead frame 60 which will be described later. The number of objects 50 to be measured and the manner of organizing them are chosen according to the needs of the application. In the present embodiment, the objects 50 to be measured are divided into two rows. The two rows of objects to be measured are respectively provided on two sides of the wiring board 40, each row comprising a plurality of objects 50 to be measured. To facilitate the transmission of an electrical signal or electric current, the objects 50 to be measured are electrically connected to the wiring board 40 in the present embodiment.
    Embodiment III:
    Fig. 12 shows an electrical assembly 104 of another embodiment according to the present invention. In comparison with Embodiment II, the electrical assembly 104 further comprises a lead frame 60. The electrical assembly 103 of Embodiment III is provided on the lead frame 60.
    The lead frame 60 is arranged to support the object 50 to be measured and the wiring board 40. The lead frame 60 is substantially in the form of an elongated plate. The lead frame 60 and the wiring board 40 are arranged to extend in the same direction. The lead frame 60 can take any form and structure provided that it meets the needs of use. In the present embodiment, in order to facilitate the electrical connection between the object 50 'to be measured and a battery which will be described later, the connection grid 60 is provided with a through-connection hole.
    In the present embodiment, the wiring board 40 is provided in a middle portion of the lead frame 60. Two rows of objects 50 to be measured are provided on two sides of the wiring board 40 respectively. two rows of objects 50 to be measured and the grid 60 are arranged to extend in the same direction. The objects 50 to be measured are arranged to directly face the connecting through hole to provide electrical connection with the battery pack described below.
    Embodiment IV:
    The present description further provides a battery (not shown in the figure). The battery pack is arranged to power an electric vehicle. The battery pack includes battery cells (not shown) and the electrical assembly 104 described in Embodiment IV.
    The battery cells and the objects 50 to be measured are electrically connected one by one. The signals and types of battery cells are selected according to the needs of the application. It is understood that the battery cells are only individual cells in the battery pack. In the present embodiments, the battery pack cells are electrically connected to the bus bar one by one.
    It should be noted that the terms "higher" and "lower" in this paper are relative concepts. More specifically, the "upper surface of the wiring board 40" in the present invention refers to its brazing face; the "lower surface of the wiring board 40" refers to an element face. In the embodiment, the lower surface of the wiring board 40 directly faces the upper surface of the heat transfer element 10; the lower surface of the heat transfer element 10 directly faces the upper surface of the object 50 to be temperature measured 50; the lower surface of the object 50 to be measured in temperature 50 directly faces an upper part of the connection grid 60; and a lower end of the lead frame 60 is directly facing a main portion of the battery.
    The above description relates only to preferred embodiments of the present invention, without limiting the scope of protection of the present invention.
    权利要求:
    Claims (20)
    [1" id="c-fr-0001]
    A temperature measuring apparatus (102), comprising: a heat transfer member (10) arranged to provide thermally conductive contact with an object (50) to be measured; a temperature measuring device (20) provided in contact with the heat transfer element (10) and arranged to be spaced from the object (50) to be measured, the temperature measuring device (20) is arranged to detecting a temperature of the object (50) to be measured and can produce a temperature signal; a wiring board (40) electrically connected to the temperature measuring device (20) for receiving and transmitting the temperature signal output from the temperature measuring device (20).
    [2" id="c-fr-0002]
    The temperature measuring apparatus (102) according to claim 1, characterized in that the wiring board (40) has a connection portion (41) protruding in the width direction; and the heat transfer element (10) and the temperature measuring device (20) are arranged on the connection part (41).
    [3" id="c-fr-0003]
    The temperature measuring apparatus (102) according to claim 2, characterized in that an observation hole (43) is extended through the connection portion in the direction of the thickness; and the observation hole (43) and the heat transfer element (10) are arranged to face each other directly.
    [4" id="c-fr-0004]
    Temperature measuring apparatus (102) according to claim 3, characterized in that the observation hole (43) comprises at least two observation holes (43), said at least two observation holes (43). being sequentially arranged along a protrusion direction of the connecting portion (41); and all the observation holes (43) are arranged to directly face the heat transfer element (10).
    [5" id="c-fr-0005]
    The temperature measuring apparatus (102) according to claim 1, characterized in that the wiring board (40) is a rigid printed circuit board or a flexible printed circuit board.
    [6" id="c-fr-0006]
    Temperature measuring apparatus (102) according to one of claims 1-5, characterized in that the temperature measuring device (20) and the wiring board (40) are soldered in accordance with surface mount.
    [7" id="c-fr-0007]
    The temperature measuring apparatus (102) according to claim 1, characterized in that the heat transfer element (10) is a thermally conductive silicone gel pad.
    [8" id="c-fr-0008]
    The temperature measuring apparatus (102) according to claim 7, characterized in that the heat transfer member (10) is an integral member made of a self-adhesive silicone gel material.
    [9" id="c-fr-0009]
    Temperature measuring apparatus (102) according to claim 7 or claim 8, characterized in that the heat transfer element (10) is arranged to deform when compressed by the temperature measuring device. (20) to thereby form a recess (11) housing the temperature measuring device (20).
    [10" id="c-fr-0010]
    The temperature measuring apparatus (102) according to claim 9, characterized in that the temperature measuring device (20) is provided in contact with a bottom wall and a side wall of the recess (11).
    [11" id="c-fr-0011]
    Temperature measuring apparatus (102) according to claim 9, characterized in that an upper surface of the heat transfer element (10) and an upper surface of the temperature measuring device (20) are provided. coplanar way.
    [12" id="c-fr-0012]
    Temperature measuring apparatus (102) according to claim 1, characterized in that the temperature measuring device (20) is a heat-sensitive resistor.
    [13" id="c-fr-0013]
    The temperature measuring apparatus (102) according to claim 12, characterized in that the temperature measuring device (20) is a surface mounted device resistor and connected to the solder wiring board.
    [14" id="c-fr-0014]
    An electrical assembly (104), comprising an object (50) to be measured and a temperature measuring apparatus (102) according to any one of claims 1 to 13; wherein the heat transfer element (10) and the object (50) to be measured are provided in thermally conductive contact.
    [15" id="c-fr-0015]
    15. Electrical assembly (104) according to claim 14, characterized in that the temperature measuring device (20) and the object (50) to be measured are isolated.
    [16" id="c-fr-0016]
    16. Electrical assembly (104) according to claim 15, characterized in that the temperature measuring device (20) and the object (50) to be measured are provided isolated by the heat transfer element (10).
    [17" id="c-fr-0017]
    Electrical assembly (104) according to claim 14, characterized in that a lower surface of the heat transfer element (10) and an upper surface of the object (50) to be measured are provided in contact.
    [18" id="c-fr-0018]
    18. Electrical assembly (104) according to claim 14, characterized in that an upper surface of the heat transfer element (10) and a lower surface of the object (40) to be measured are provided in contact.
    [19" id="c-fr-0019]
    Electrical assembly (104) according to claim 18, characterized in that the heat transfer element (50) is provided to deform under pressure between the wiring board (40) and the object (50) to be measured. .
    [20" id="c-fr-0020]
    The electrical assembly (104) of claim 14, characterized in that the electrical assembly (104) further comprises a lead frame (60); and the wiring board (40) and the object (50) to be measured are respectively provided on the lead frame (60).
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    同族专利:
    公开号 | 公开日
    FR3057952B3|2018-10-19|
    CN205861226U|2017-01-04|
    US10704961B2|2020-07-07|
    DE202017104847U1|2017-08-25|
    US20180045576A1|2018-02-15|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
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    DE10214368B4|2002-03-30|2007-09-13|Robert Bosch Gmbh|Energy storage module and its use for an electrical appliance|
    US8747977B2|2012-09-20|2014-06-10|International Business Machines Corporation|Multilayer hose with leak preventative interfacial layer containing super absorbent polymer |
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    CN111430827A|2020-03-19|2020-07-17|安捷利（番禺）电子实业有限公司|Battery core temperature acquisition device, busbar and battery core|
    WO2022006801A1|2020-07-09|2022-01-13|威睿电动汽车技术有限公司|Temperature monitoring apparatus and battery module having same|
    法律状态:
    2018-06-12| PLFP| Fee payment|Year of fee payment: 2 |
    2020-06-11| PLFP| Fee payment|Year of fee payment: 4 |
    2021-06-11| PLFP| Fee payment|Year of fee payment: 5 |
    优先权:
    申请号 | 申请日 | 专利标题
    CN201620876957.7U|CN205861226U|2016-08-12|2016-08-12|Temperature measuring equipment, electric appliance component and battery bag|
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